Devices with semiconductor hyperbolic metamaterials
US11448824B2 · kind B2 · utility
0Cited by
5References
18Claims
0Family size
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Key dates
| Filing date | Mar 21, 2016 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Dec 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/32341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hyperbolic metamaterial assembly comprising alternating one or more first layers and one or more second layers forming a hyperbolic metamaterial, the one or more first layers comprising an intrinsic or non-degenerate extrinsic semiconductor and the one or more second layers comprising a two-dimensional electron or hole gas, wherein one of in-plane or out-of-plane permittivity of the hyperbolic metamaterial assembly is negative and the other is positive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.