Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device
US11448914B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Oct 20, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13332
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic module that comprises preparing an electronic device in which a first substrate and a second substrate have been joined and coupling the electronic device to a package member. The first substrate includes a front surface, a back surface on an opposite side of the front surface, and a first side surface between an edge portion of the front surface and an edge portion of the back surface. The package member includes a first portion that includes an opening and a second portion that is arranged at a position which does not overlap the opening. The coupling includes bringing the first side surface into contact with the second portion in a state in which the second substrate is positioned between the first portion and the first substrate, and fixing the package member and the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.