Inventor · Yokohama, JP

Jun Tsukano

14Patents
5h-index
13Co-inventors
63Inventor score

Filing activity: Mar 7, 2003 → May 16, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US6762488B2 Light thin stacked package semiconductor device and process for fabrication thereof Electricity 125 Expired
US7745736B2 Interconnecting substrate and semiconductor device Electricity 8 Active
US7838779B2 Wiring board, method for manufacturing same, and semiconductor package Electricity 8 Active
US7649749B2 Wiring substrate, semiconductor device, and method of manufacturing the same Electricity 6 Active
US7911038B2 Wiring board, semiconductor device using wiring board and their manufacturing methods Electricity 5 Active
US8304918B2 Method for manufacturing electronic device and electronic device Electricity 3 Active
US7674989B2 Wiring board and method for manufacturing the same Emerging Cross-Sectional Technologies 1 Active
US12292657B2 Electronic component, manufacturing method thereof, and electronic apparatus Electricity 0 Active
US7888809B2 Semiconductor device and method of manufacturing the same Electricity 0 Active
US11528392B2 Electronic component including electronic substrate and circuit member, apparatus, and camera Emerging Cross-Sectional Technologies 0 Active
US11765448B2 Electronic component including electronic substrate and circuit member, apparatus, and camera Emerging Cross-Sectional Technologies 0 Active
US7701726B2 Method of manufacturing a wiring substrate and semiconductor device Electricity 0 Active
US8389414B2 Method of manufacturing a wiring board Electricity 0 Active
US11448914B2 Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.