Edge ring and heat treatment apparatus having the same
US11450551B2 · kind B2 · utility
2Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Aug 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are an edge ring and a heat treatment apparatus having the same. The edge ring includes a main body having a ring shape. The main body includes a substrate support part configured to support an edge of a bottom surface of a substrate, an outer band provided outside the substrate support part and having a top surface that is higher than a top surface of the substrate support part and is parallel to a top surface of the substrate supported by the substrate support part, an outer sidewall provided outside the outer band, and a groove part provided between the substrate support part and the outer band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.