Method of fabricating package structure
US11450641B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Nov 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method for forming a conductive feature including forming a seed layer over a substrate; forming a patterned mask layer on the seed layer, wherein the patterned mask layer has an opening exposing the seed layer; forming a conductive material in the opening; removing the patterned mask layer to expose a portion of the seed layer; and removing the portion of the seed layer by using an etching solution including a protective agent, thereby forming a conductive feature, wherein the protective agent has multiple active sites to adsorb on the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.