3D microscopy
US11454798B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2018 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jul 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/10056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microscopy method for three-dimensionally imaging an object, including imaging the object along a beam path into a first image on a first image plane. A first microlens array is arranged on the first image plane, and a second microlens array with the same pitch is arranged downstream of the first array. The two arrays laterally segment the first image and image same into a second image in which the segments are spaced apart and separated by gaps. On a pupil plane downstream of the microlens array, a provided phase mask generates a spot for each segment of the second image according to a pixel diffusion function. A detector detects the shape and structure of the spot, and a controller ascertains a lateral intensity distribution and depth specification from the shape and/or structure of the spot for each segment and generates a depth-resolved image of the object therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.