Plasma-generating unit and substrate treatment apparatus including the same
US11456154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2015 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jan 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treatment apparatus including a process chamber, a supporting unit, a gas supplying unit, and a plasma generating unit. The plasma generating unit may include a power, a primary antenna connected to the power through a first line, a secondary antenna connected to the power through a second line diverging from the first line at a first junction, the primary and secondary antennas being connected in parallel to the power, a third reactance device connected to the power through a third line diverging from the second line at a second junction, the secondary antenna and the third reactance device being connected in parallel to the power, and a variable reactance installed on the second line between the second junction and the secondary antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.