Apparatus and method for cooling substrate
US11456192B2 · kind B2 · utility
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0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.