SEMIgear, Inc.
19Patents
17Active
19Granted
45Portfolio score
Filing activity: Jul 1, 2002 → Mar 19, 2020 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6827789B2 | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry | Emerging Cross-Sectional Technologies | 374 | Expired |
| US7008879B2 | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry | Emerging Cross-Sectional Technologies | 364 | Expired |
| US9472531B2 | Device packaging facility and method, and device processing apparatus utilizing phthalate | Electricity | 4 | Active |
| US8252678B2 | Flux-free chip to wafer joint serial thermal processor arrangement | Electricity | 3 | Active |
| US9226407B2 | Reflow treating unit and substrate treating apparatus | Performing Operations; Transporting | 2 | Active |
| US9741683B2 | Device packaging facility and method, and device processing apparatus utilizing phthalate | Electricity | 1 | Active |
| US7982320B2 | Arrangement for solder bump formation on wafers | Electricity | 1 | Active |
| US10283481B2 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Electricity | 1 | Active |
| US7632750B2 | Arrangement for solder bump formation on wafers | Electricity | 1 | Active |
| US9824998B2 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Electricity | 1 | Active |
| US10861735B2 | Substrate support unit | Emerging Cross-Sectional Technologies | 1 | Active |
| US10790179B2 | Alignment apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
| US9629258B2 | Reflow treating unit and substrate treating apparatus | Performing Operations; Transporting | 0 | Active |
| US11315807B2 | Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method | Electricity | 0 | Active |
| US8524593B2 | Arrangement for solder bump formation on wafers | Electricity | 0 | Active |
| US11456192B2 | Apparatus and method for cooling substrate | Electricity | 0 | Active |
| US10937757B2 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Electricity | 0 | Active |
| US9572266B2 | Reflow treating unit and substrate treating apparatus | Performing Operations; Transporting | 0 | Active |
| US8274161B2 | Flux-free chip to substrate joint serial linear thermal processor arrangement | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.