Wafer processing apparatus and wafer processing method using the same apparatus
US11456195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jan 2, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.