Thermal assemblies for multi-chip packages
US11456232B2 · kind B2 · utility
1Cited by
2References
22Claims
0Family size
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Key dates
| Filing date | Aug 10, 2018 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jan 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.