Semiconductor device and fabrication method for the same
US11456247B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 13, 2019 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reliable semiconductor device is provided. The semiconductor device includes at least one die. The at least one die includes an integrated circuit region, a first recess region surrounding the integrated circuit region, and a second recess region surrounding the first recess region. A first recess is disposed in the first recess region and a second recess is disposed in the second recess region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.