Method of using a processing oven
US11456274B1 · kind B1 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2022 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of using an oven includes supporting a substrate on a rotatable spindle in a processing chamber of the oven and rotating the substrate. The method may also include raising the spindle with the substrate to a heating zone and activating a lamp assembly to heat a top surface of the substrate. The substrate may then be lowered to a dosing zone and a chemical vapor directed into the processing chamber above the substrate. The substrate may then be further heated using the lamp assembly and cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.