Method of manufacturing a microelectronic device having an array of inclined reliefs
US11456403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Mar 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is provided for producing a microelectronic device having a subsequent grating of reliefs of which at least one wall is slanted, the method including providing a structure including a base, and an initial grating of reliefs, each relief having at least one proximal end in contact with the base, a distal end, and at least one wall extending between the proximal end and the distal end; and laying the reliefs of the initial grating on one another, by application of at least one stress on the structure, such that walls facing two adjacent reliefs come into contact, thus generating at least one subsequent grating of reliefs of which at least one wall is slanted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.