Hubert Teyssedre
7Patents
0h-index
7Co-inventors
30Inventor score
Filing activity: Dec 19, 2018 → Nov 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11456403B2 | Method of manufacturing a microelectronic device having an array of inclined reliefs | Electricity | 0 | Active |
| US11444041B2 | Process of realization of an area of individualization of an integrated circuit | Electricity | 0 | Active |
| US12233577B2 | Method for manufacturing a mould for nanoprinting and associated mould | Electricity | 0 | Active |
| US11880131B2 | Process for transfer imprinting | Chemistry; Metallurgy | 0 | Active |
| US12218083B2 | Method of making an individualization zone of an integrated circuit | Electricity | 0 | Active |
| US12366801B2 | Process for transfer imprinting | Chemistry; Metallurgy | 0 | Active |
| US10886239B2 | Customisation of an integrated circuit during the realisation thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.