Shield printed wiring board and method of manufacturing shield printed wiring board
US11457527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2019 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Dec 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/05
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.