Direct metalized guide plate
US11460485B2 · kind B2 · utility
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4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.