Patent · US Active

Photonics package integration

US11460651B2 · kind B2 · utility

1Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 2, 2020
Grant dateOct 4, 2022
Priority date—
Expiry dateNov 2, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L25/167
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.