Method for the qualification of a mask for microlithography
US11460785B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | May 21, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | May 21, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For the qualification of a mask for microlithography, the effect of an aerial image of the mask on the wafer is ascertained by means of a simulation for predicting the wafer structures producible by means of the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.