Patent · US Active

Method for the qualification of a mask for microlithography

US11460785B2 · kind B2 · utility

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24Claims
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Key dates

Filing dateMay 21, 2020
Grant dateOct 4, 2022
Priority date
Expiry dateMay 21, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/70625
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

For the qualification of a mask for microlithography, the effect of an aerial image of the mask on the wafer is ascertained by means of a simulation for predicting the wafer structures producible by means of the mask.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.