Patent · US Active

Micro-trenching mold interface in a pop package

US11462527B2 · kind B2 · utility

0Cited by

5References

25Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Kumar Abhishek Singh · Phoenix, US
Zhaozhi Li · Chandler, US
Thomas J. Debonis · Tempe, US
Robert M. Nickerson · Chandler, US
Rees WINTERS · Glendale, US

Key dates

Filing date	Jul 30, 2018
Grant date	Oct 4, 2022
Priority date	—
Expiry date	Jan 23, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.