Conformable heat sink interface with a high thermal conductivity
US11464139B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Nov 5, 2018 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Feb 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.