Christopher Wade Ackerman
10Patents
3h-index
39Co-inventors
56Inventor score
Filing activity: Jun 26, 2007 → Nov 29, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9347987B2 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Electricity | 11 | Active |
| US7701238B2 | Active thermal control using a burn-in socket heating element | Physics | 4 | Active |
| US9448278B2 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | Electricity | 3 | Active |
| US10281521B2 | System for thermal management of device under test (DUT) | Physics | 3 | Active |
| US11032941B2 | Modular thermal energy management designs for data center computing | Electricity | 2 | Active |
| US11464139B2 | Conformable heat sink interface with a high thermal conductivity | Electricity | 1 | Active |
| US12392818B2 | Enhanced jet impingement leak prevention for integrated circuit | Electricity | 0 | Active |
| US11808813B2 | Apparatus and method for controlling unit specific junction temperature with high temporal resolution for concurrent central processing unit (CPU) core testing | Physics | 0 | Active |
| US9207274B2 | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | General | 0 | Revoked |
| US12000487B2 | System and apparatus having a seal member for sealing of a device under test | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.