Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
US11466234B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.