Stress measurement method, stress measurement device, and stress measurement system
US11467046B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jul 4, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0641
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.