Method and apparatus for generating a correction line indicating relationship between deviation of an edge of a wafer pattern from an edge of a reference pattern and space width of the reference pattern, and a computer-readable recording medium
US11468555B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jun 4, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of generating a correction line indicating a relationship between an amount of deviation of an edge of a wafer pattern from an edge of a reference pattern and a width of a space adjacent to the edge of the reference pattern, includes: creating an appearance-frequency graph of widths of spaces adjacent to reference patterns located within a designated area; obtaining images of wafer patterns corresponding to a plurality of space widths shown in the appearance-frequency graph; calculating amounts of deviation between edges of the wafer patterns on the images and edges of corresponding reference patterns; plotting a plurality of data points on a coordinate system, the plurality of data points being specified by the plurality of space widths and the amounts of deviation; and generating a correction line from the plurality of data points on the coordinate system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.