Contactless latch and coupling for vacuum wafer transfer cassette

US11469124B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shreyas Patil Shanthaveeraswamy · Kanchinakote, IN
• Ribhu Gautam · Singapore, SG
• Kumaresan Nagarajan · Bengaluru, IN
• Vijay Singh · Pittsburgh, US
• Andrew J. Constant · Cupertino, US
• Michael P. Karazim · San Jose, US
• Kim Vellore · San Jose, US

Key dates

• Filing date: Jan 24, 2020
• Grant date: Oct 11, 2022
• Expiry date: Apr 9, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67748
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.