Patent · US Active

Plating chuck

US11469134B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Hui Wang · Shanghai, CN
Jian Wang · Rosharon, US
Zhaowei Jia · Shanghai, CN
Hongchao Yang · Shanghai, CN

Key dates

Filing date	Sep 7, 2017
Grant date	Oct 11, 2022
Priority date	—
Expiry date	Jan 28, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/94
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.