Patent · US Active

Semiconductor device package and acoustic device having the same

US11477559B2 · kind B2 · utility

2Cited by

1References

7Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Ming-Tau Huang · Kaohsiung, TW
Kuei-Hao Tseng · Kaohsiung, TW
Hung-I Lin · Cambridge, US

Key dates

Filing date	Jul 31, 2019
Grant date	Oct 18, 2022
Priority date	—
Expiry date	Jul 31, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2499/11
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.