PCB structure for embedding electronic components
US11477892B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2019 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.