John Harris
5Patents
2h-index
6Co-inventors
40Inventor score
Filing activity: Dec 29, 2003 → May 6, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6856014B1 | Method for fabricating a lid for a wafer level packaged optical MEMS device | Performing Operations; Transporting | 34 | Expired |
| US7306975B2 | Semiconductor wafer cutting blade and method | Electricity | 4 | Expired |
| US11477892B2 | PCB structure for embedding electronic components | Electricity | 0 | Active |
| US12202038B2 | Device for marking a moulded or cast form | Performing Operations; Transporting | 0 | Active |
| US11935810B2 | Chip warpage reduction via raised free bending and re-entrant (auxetic) trace geometries | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.