Selective laser solidification apparatus and method
US11478856B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2019 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Dec 13, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A selective laser solidification apparatus including; a powder bed onto which powder layers can be deposited, at least one laser module for generating a plurality of laser beams for solidifying the powder material deposited onto the powder bed, a laser scanner for individually steering each laser beam to solidify separate areas in each powder layer, and a processing unit. A scanning zone for each laser beam is defined by the locations on the powder bed to which the laser beam can be steered by the laser scanner. The laser scanner is arranged such that each scanning zone is less than the total area of powder bed and at least two of the scanning zones overlap. The processing unit is arranged for selecting, for at least one powder layers, which laser beam to use to scan an area of the powder layer located within a region wherein the seaming zones overlap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.