Substrate processing apparatus and substrate processing method
US11482428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2019 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jan 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.