Cutting method of workpiece by forming reformed region and dry etching process
US11482455B2 · kind B2 · utility
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Key dates
| Filing date | Jul 18, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jul 17, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.