Patent · US Active

Radio-frequency device with radio-frequency chip and waveguide structure

US11482771B2 · kind B2 · utility

1Cited by

0References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Lampersberger · Linz, AT
Reinhard Feger · Bischofshofen, AT
Markus Lang · Munich, DE
Juergen Minichshofer · Linz, AT
Ernst Seler · Munich, DE
Andreas Stelzer · Linz, AT

Key dates

Filing date	Jan 12, 2021
Grant date	Oct 25, 2022
Priority date	—
Expiry date	Jan 29, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q21/20
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.