Patent · US Active

Micromechanical device and method for manufacturing a micromechanical device

US11486782B2 · kind B2 · utility

2Cited by

3References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Friedjof Heuck · Stuttgart, DE
Mike Schwarz · Aspenhausiedlung, DE
Thomas Friedrich · Bietigheim-Bissingen, DE
Volkmar Senz · Metzingen, DE

Key dates

Filing date	Jul 16, 2018
Grant date	Nov 1, 2022
Priority date	—
Expiry date	Jul 4, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01N2291/02845
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.