Method for manufacturing semiconductor package
US11488841B2 · kind B2 · utility
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1References
15Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 19, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Oct 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85455
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.