Inventor · Daejeon, KR

Yong Sung EOM

29Patents
5h-index
30Co-inventors
69Inventor score

Filing activity: Jun 27, 2002 → May 31, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6707161B2 Optical module package of flip chip bonding Electricity 13 Expired
US7520682B2 Transceiver module and optical bench for passive alignment Physics 7 Expired
US9853010B2 Method of fabricating a semiconductor package Electricity 7 Active
US9490198B1 Transmitting and receiving package Electricity 6 Active
US6825065B2 Method for optical module packaging of flip chip bonding Electricity 6 Expired
US10636761B2 Method of fabricating a semiconductor package Electricity 5 Active
US8211745B2 Method and structure for bonding flip chip Electricity 5 Active
US8044757B2 Electronic device including LTCC inductor Electricity 4 Active
US7244923B2 Surface emitting laser device including optical sensor and optical waveguide device employing the same Electricity 4 Expired
US8030200B2 Method for fabricating a semiconductor package Electricity 3 Active
US7012939B2 Wavelength stabilization module having light-receiving element array and method of manufacturing the same Electricity 2 Expired
US8547278B2 Sensing device having multi beam antenna array Electricity 2 Active
US9538666B2 Bonding structure of electronic equipment Emerging Cross-Sectional Technologies 1 Active
US9462736B2 Composition and methods of forming solder bump and flip chip using the same Emerging Cross-Sectional Technologies 1 Active
US8420722B2 Composition and methods of forming solder bump and flip chip using the same Emerging Cross-Sectional Technologies 1 Active
US7985697B2 Wafer level package and method of fabricating the same Electricity 0 Active
US12206056B2 Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials Electricity 0 Active
US9006037B2 Methods of forming bump and semiconductor device with the same Electricity 0 Active
US8794502B2 Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same Electricity 0 Active
US11488841B2 Method for manufacturing semiconductor package Electricity 0 Active
US9155236B2 Composition and methods of forming solder bump and flip chip using the same Emerging Cross-Sectional Technologies 0 Active
US8802760B2 Composition and methods of forming solder bump and flip chip using the same Emerging Cross-Sectional Technologies 0 Active
US11677060B2 Method for transferring and bonding of devices Electricity 0 Active
US8524571B2 Vacuum wafer level packaging method for micro electro mechanical system device Electricity 0 Active
US9034750B2 Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.