Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same
US11488900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2021 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a wiring board with an embedded interposer substrate includes preparing a main substrate, forming a recess on the main substrate, placing an interposer substrate into the recess, electrically connecting a second pad of the interposer substrate and the first pad of the main substrate, and filling a gap between the interposer substrate and the main substrate with an underfill. The recess exposes a first pad of the main substrate. A second pad of interposer substrate and the first pad of the main substrate are made of the same metal and formed in different outer surface profiles. The underfill entirely touches side surfaces and a bottom surface of the interposer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.