Apparatus and techniques for electronic device encapsulation
US11489119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2019 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Jan 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.