Substrate bonding method and laminated body production method
US11491772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2017 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Nov 15, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.