Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
US11492251B2 · kind B2 · utility
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4References
9Claims
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Key dates
| Filing date | Nov 4, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Nov 4, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In an embodiment, a method for manufacturing a micro-electro-mechanical systems (MEMS) transducer device includes providing a substrate body with a surface, depositing an etch-stop layer (ESL) on the surface, depositing a sacrificial layer on the ESL, depositing a diaphragm layer on the sacrificial layer and removing the sacrificial layer, wherein depositing the sacrificial layer includes depositing a first sub-layer of a first material and depositing a second sub-layer of a second material, and wherein the first material and the second material are different materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.