Nitride ceramic resin composite body
US11492299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2018 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Jan 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.