Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element

US11493532B2 · kind B2 · utility

Assignee

• Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

• Erhard Landgraf · Dresden, DE
• Stephan Gerhard Albert · Munich, DE
• Steffen Bieselt · Wehlen, DE
• Sebastian PREGL · Dresden, DE
• Matthias Rose · Eindhoven, NL

Key dates

• Filing date: Aug 19, 2020
• Grant date: Nov 8, 2022
• Expiry date: Mar 2, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/088
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method produces a micromechanical sensor element having a first electrode and a second electrode, wherein electrode wall surfaces of the first and the second electrodes are situated opposite one another in a first direction and form a capacitance, wherein one of the first electrode or the second electrode is movable in a second direction, in response to a variable to be detected, and a second one of the first electrode and the second electrode is fixed. The method includes producing a cavity in a semiconductor substrate, the cavity being closed by a doped semiconductor layer; producing the first and the second electrodes in the semiconductor layer, including modifying the electrode wall surface of the first electrode in order to have a smaller extent in the second direction than the electrode wall surface of the second electrode.