QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
US11495524B2 · kind B2 · utility
1Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Sep 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10636
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.