Inventor · Fort Worth, TX, US

Abram Castro

38Patents
10h-index
18Co-inventors
72Inventor score

Filing activity: Feb 6, 1995 → Nov 8, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US7898083B2 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Electricity 91 Active
US5650593A Thermally enhanced chip carrier package Electricity 82 Expired
US6107683A Sequentially built integrated circuit package Electricity 64 Expired
US7390700B2 Packaged system of semiconductor chips having a semiconductor interposer Electricity 55 Active
US6300165A Ball grid substrate for lead-on-chip semiconductor package Electricity 44 Expired
US6534861B1 Ball grid substrate for lead-on-chip semiconductor package Electricity 28 Expired
US8133761B2 Packaged system of semiconductor chips having a semiconductor interposer Electricity 17 Active
US7569918B2 Semiconductor package-on-package system including integrated passive components Electricity 10 Active
US7573139B2 Packed system of semiconductor chips having a semiconductor interposer Electricity 10 Active
US6801438B1 Electrical circuit and method of formation Electricity 10 Expired
US6248612A Method for making a substrate for an integrated circuit package Electricity 9 Expired
US6501168B1 Substrate for an integrated circuit package Electricity 8 Expired
US9305869B1 Packaged semiconductor device having leadframe features as pressure valves against delamination Electricity 6 Active
US9214440B1 Method for preventing die pad delamination Electricity 3 Active
US9780017B2 Packaged device with additive substrate surface modification Electricity 2 Active
US9524926B2 Packaged device with additive substrate surface modification Electricity 2 Active
US9129955B2 Semiconductor flip-chip system having oblong connectors and reduced trace pitches Electricity 2 Active
US9875930B2 Method of packaging a circuit Electricity 1 Active
US11495524B2 QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same Electricity 1 Active
US8530360B2 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Electricity 1 Active
US9601414B2 Method for preventing die pad delamination Electricity 0 Active
US9142472B2 Integrated circuit and method of making Electricity 0 Active
US11854947B2 Integrated circuit chip with a vertical connector Electricity 0 Active
US10199348B2 Plastic-packaged semiconductor device having wires with polymerized insulating layer Electricity 0 Active
US11177195B2 Multi-lead adapter Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.