Superconducting structure and device surface termination with alloy
US11495724B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
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Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/855
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a superconductor device includes providing a first metal layer on top of the substrate. An oxidation of a top surface of the first metal layer is rejected. A second metal layer is deposited on top of the second metal layer. A superconducting alloy of the first metal layer and the second metal layer is created between the first metal layer and the second metal layer. There is no oxide layer between the superconducting alloy and the first metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.