No-gel pressure sensor package
US11498829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jan 16, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0172
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.