Plated laminate and printed circuit board
US11499233B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2019 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Oct 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.