Managing adhesive curing for photonic system assembly
US11500156B2 · kind B2 · utility
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1References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jul 21, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.