Luc Belanger
8Patents
4h-index
24Co-inventors
53Inventor score
Filing activity: Feb 1, 2005 → Jul 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7332424B2 | Fluxless solder transfer and reflow process | Electricity | 20 | Expired |
| US8003512B2 | Structure of UBM and solder bumps and methods of fabrication | Electricity | 12 | Active |
| US7820483B2 | Injection molded soldering process and arrangement for three-dimensional structures | Electricity | 6 | Active |
| US10867533B2 | Light-emitting sign apparatus | Physics | 6 | Active |
| US8314500B2 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Electricity | 2 | Active |
| US7952205B2 | Injection molded soldering process and arrangement for three-dimensional structures | Electricity | 2 | Active |
| US11500156B2 | Managing adhesive curing for photonic system assembly | Physics | 0 | Active |
| US7932169B2 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.